As The Power Dissipated By Electronic Components And Equipment Continues To Increase, Thermal Analysis And Thermal Control Are Essential To Ensure The Thermal Reliability Of Components And Electronic Equipment. Reasonable Thermal Design Can Greatly Shorten The Product Development Cycle And Reduce Costs.

    Thermal Design Of Electronic Products Can Use Passive Technologies In The Form Of Conduction, Radiation Or Natural Convection, Or Active Technologies Using Forced Air Cooling, Heat Exchangers Or Circulating Coolant. In Addition, Some Advanced Heat Dissipation Technologies Based On New Heat Transfer Devices, Such As Heat Pipe Technology, Vacuum Cold Plate Technology, Microchannel Technology, And Temperature Difference Refrigeration Technology, Are Also Being Increasingly Widely Adopted. (Keep The Original Image)
     Our Engineers Have Extensive Experience In Heat Dissipation And Structural Design And Are Equipped With Advanced Experimental Equipment. It Can Conduct Computer CFD (Computational Fluid Dynamics) Simulation Design Based On The Customer's Heat Dissipation Requirements And Corresponding Original Data, Provide The Best Heat Dissipation Solution Report, And Can Vividly Display The Heat Dissipation Effect After Adopting The Relevant Heat Dissipation Solution. At The Same Time, We Can Quickly Produce Samples And Conduct Heat Dissipation Effect And Engineering Structure Testing Until We Can Supply Batch Products With Stable And Reliable Quality. Our Engineers Are Especially Good At Solving: The Contradiction Between The Product's Heat Dissipation Requirements And The Small Size, Effective Heat Dissipation Of High-Power Devices, The Conflict Between Heat Dissipation And EMI Design, The Reliability Of Outdoor Cooling Products, Low Weight And High-Efficiency Heat Dissipation Requirements And Other Heat Dissipation Problems. .
  Original Parameters Required For Heat Dissipation Design:
(1) Product Overview
(2) Product Structure Drawings
(3) Product Heat Dissipation Power (Including Overall Machine Power And Layout Of Heating Devices)
(4) Product Application Environment Temperature And Temperature Control Requirements Requirements (5) Other Requirements (Noise, Weight, Protection, Etc.)
 
Design Process: