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CNCONTACT US
- Address
- 3rd Floor, Building 8-2, Kukeng Tongfu Industrial Zone, Guanlan Street, Longhua District, Shenzhen City, Guangdong Province
- Phone
- +86-755-28062190 / 13728860027
- wangym@sayestech.com
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Chip Level Heat
The main heat source of a device is two power amplifiers, which need to share a radiator for power amplifier heat dissipation. Equipment use environment is harsh: environmental temperature change :55.0℃, heat dissipation design to...
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Board Level Heat
A 14-slot communications enclosure requires heat dissipation simulation calculations for boards in specific slots. The board is mainly composed of the mother board, sub-board and module, connector...
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System Level Heat
The communication chassis needs to be simulated for the system, Thus evaluate the system flow distribution, optimize the air duct, and provide a good strip for board heat dissipation.
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Enclosed Equipment
The heat dissipation design of sealed products has always been a long-standing heat dissipation problem in communications, military, industrial control and other industries, and the prominent contradictions are mainly reflected in...
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