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Current Location:Home > Products > Heat pipe model

Heat pipe model

Heat pipe is a very efficient heat conduction element, and its heat transfer efficiency can reach dozens of times that of metal. Since the heat pipe technology was introduced into the radiator manufacturing industry, the heat pipe module with the heat pipe as the core, with heat sink, fin, fan, etc., can solve the heat dissipation problem caused by small space or too much heat concentration, and overcome the contradiction between the heat dissipation power and the effective heat dissipation capacity that the traditional heat dissipation mode can not overcome.

The heat pipe can be bent and flattened within a certain limit to meet the needs of different structures. On the basis of the heatpipe heat transfer principle, other efficient heat transfer devices have also been derived, such as heat column, vacuum cold plate (vapour chamber), loop heatpipe, etc., which can meet various special needs.

· Through-connecting heat pipe cooling module
The heat pipe heat dissipation module is connected with a high-density heat dissipation fin at the heat pipe heat dissipation end. The fin material can be copper or aluminum, and the fin is connected with the heat pipe by welding.
The perforated heat pipe cooling module can greatly reduce the product volume, and greatly improve the heat dissipation efficiency, which has a wide range of applications in notebook computers, communication equipment, industrial control products and other fields.

· Embedded heat pipe cooling module
The heat pipe is embedded in the bottom plate of the radiator, which can balance the temperature of the bottom plate and improve the heat dissipation efficiency. Especially for the heat source location is concentrated, the radiator floor area is large, the temperature equalization effect is very significant.
From the point of view of heat transfer, the thermal resistance of the whole radiator will be effectively reduced, and the heat dissipation effect of the radiator will be greatly improved, so that the surface temperature of the heating component will be greatly reduced.
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