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Current Location:Home > Case > Chip Level Heat

Chip Level Heat

The main heat source of a device is two power amplifiers, which need to share a radiator for power amplifier heat dissipation. The use of the equipment is harsh: ambient temperature: 55.0 ° C, the heat dissipation design should be able to provide good heat dissipation conditions for the power amplifier, the temperature rise is less than 15.0 ° C and the weight of the radiator is as light as possible.

The following are the main thermal parameters and installation of the power amplifier:

Heating power: 80.0W/PCS

Dimensions: 230.0X160.0X26.0mm

Provide air volume: The system can provide a uniform air volume of 1.0m/s to the radiator

Interface material: imported THERMAL PAD material, thermal conductivity is 3.2w/m.k, thickness 0.5mm



 

Customer heat dissipation scheme parameter table

外型尺寸(mm)

基板厚度(mm)

齿片厚度(mm)

齿片间距(mm)

材料

表面处理方式

350.0*240.0*85.0

16.0

2.8

9.5

AL-6063-T5

本色阳极氧化




 


 

 

 

Optimized heat dissipation scheme parameter table

 

外型尺寸(mm)

基板厚度(mm)

齿片厚度(mm)

齿片间距(mm)

材料

表面处理方式

350.0*240.0*85.0

12.0

2.8

1.0

AL-6063-T5

镀镍


 

 

 


 

 

After optimization, the maximum temperature of the surface of the radiator is reduced by 2.5 degrees Celsius, and the weight of the entire radiator is greatly reduced, which well meets the design needs of the product.

 


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