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ZETA • PRODUCTS

Sayes has a wide range of different heat sink products, and can provide one-stop service from design to production.

ZETA • R&D Center

Sayes has a professional thermal design R&D team, equipped with advanced thermal design software and experimental analysis instruments. We can provide full service from thermal design to product mass production. We are skilled in solving extreme heat dissipation problems.

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ZETA • CASE

Sanye is fully committed to the research and development and manufacturing of electronic heat dissipation products, providing you with full process services from heat dissipation scheme design to heat dissipation product manufacturing

Chip Level Heat

Chip Level Heat

The main heat source of a device is two power amplifiers, which need to share a radiator for power amplifier heat dissipation. Equipment use environment is harsh: environmental temperature change :55.0℃, heat dissipation design to...

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Board Level Heat

Board Level Heat

A 14-slot communications enclosure requires heat dissipation simulation calculations for boards in specific slots. The board is mainly composed of the mother board, sub-board and module, connector...

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System Level Heat

System Level Heat

The communication chassis needs to be simulated for the system, Thus evaluate the system flow distribution, optimize the air duct, and provide a good strip for board heat dissipation.

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Enclosed Equipment

Enclosed Equipment

The heat dissipation design of sealed products has always been a long-standing heat dissipation problem in communications, military, industrial control and other industries, and the prominent contradictions are mainly reflected in...

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ZETA • testing equipment

Sayes has advanced production and testing equipment, and can produce high-end heat sink products.

Solution

The product is widely used in fields such as communication equipment, industrial control equipment, optoelectronic equipment, medical equipment, military industry, new energy, servers, etc

ZETA • customers

National University of Defense Technology CETC JPT AVIC MAX mindray Neusoft H3C SUNGROW HUAWEI
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