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Chip Level Heat Board Level Heat System Level Heat Enclosed Equipment

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Current Location：Home > Case > 系统级散热设计

系统级散热设计

通讯机箱需要对系统进行仿真计算，从而评估系统流量分布，优化风道，为单板散热提供良好的条件。


运算仿真结果

截面速度矢量图


 

风量云图

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