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A 14-slot communications enclosure requires heat dissipation simulation calculations for boards in specific slots. The board consists of a mother board, a child board, modules, and connectors. The heat dissipation design should make all the devices on the board meet the junction temperature requirements in the chip specifications, and it is best to control it at about 100.0 ° C.
Related heat dissipation conditions:
Ambient temperature: 55.0 ° C
The air speed of the slot inlet is 2.0m/s
The heating power of the whole board is roughly 120.0W
Power consumption list of main heating components:
|
芯片名称 |
发热功率 |
单板用量 |
发热功率 |
备注 |
|
IC1 |
15W |
1 |
15W |
|
|
DDR2 |
9W |
2 |
18W |
数量标准配置的50% |
|
Flash |
0.264W |
2 |
0.528W |
|
|
Compact Flash |
0.33W |
1 |
0.33W |
|
|
IC2 |
0.408W |
1 |
0.408W |
|
|
Power Control |
|
1 |
|
|
|
IC3 |
0.248W |
1 |
0.248W |
|
|
IC4 |
13.02w |
1 |
13.02W |
|
|
IC54 |
3.43W |
1 |
3.43W |
|
|
TDM Clock |
0.5W |
1 |
0.5W |
|
|
IC6 |
2.1W |
1 |
2.1W |
|
|
IC7 |
8.37W |
1 |
8.37W |
|
|
IC8 |
2W |
1 |
2W |
|
|
IC9 |
0.4W |
3 |
1.2W |
|
|
IC10 |
0.5W |
36 |
18W |
数量标准配置的50% |
|
IC11 |
1.641W |
16 |
26.256W |
|
|
Shared Memory |
1.341W |
4 |
5.364W |
|
|
IC12 |
6.35W |
1 |
6.35W |
|
|
TOTAL:121.4W |
||||
Simulation model:
According to the relevant design data provided by the customer, the relevant radiator is designed for the main heating components. The appearance is as follows:
Thickness of thermal pad \ Thermal conductivity: 0.25mm\1.4W/m-k (with thermal pad on the bottom)
Simulation results:
Veneer wind speed vector diagram
Board temperature cloud image
