+86-755-28062190 设为主页 收藏本站 欢迎访问三烨科技有限公司官网!

设计实例

CASE

需要更多资讯?

请直接与我们联络

地址
深圳市龙华区观澜街道大富社区平安路58号共联富基创新园3栋1-4层
电话
+86-755-28062190 / 13728860027(微信同号)
邮箱
wangym@sayestech.com
当前位置:首页 > 设计实例 > Chip Level Heat

Chip Level Heat

The main heat source of a device is two power amplifiers, which need to share a radiator for power amplifier heat dissipation. The use of the equipment is harsh: ambient temperature: 55.0 ° C, the heat dissipation design should be able to provide good heat dissipation conditions for the power amplifier, the temperature rise is less than 15.0 ° C and the weight of the radiator is as light as possible.

The following are the main thermal parameters and installation of the power amplifier:

Heating power: 80.0W/PCS

Dimensions: 230.0X160.0X26.0mm

Provide air volume: The system can provide a uniform air volume of 1.0m/s to the radiator

Interface material: imported THERMAL PAD material, thermal conductivity is 3.2w/m.k, thickness 0.5mm



 

Customer heat dissipation scheme parameter table

外型尺寸(mm)

基板厚度(mm)

齿片厚度(mm)

齿片间距(mm)

材料

表面处理方式

350.0*240.0*85.0

16.0

2.8

9.5

AL-6063-T5

本色阳极氧化




 


 

 

 

Optimized heat dissipation scheme parameter table

 

外型尺寸(mm)

基板厚度(mm)

齿片厚度(mm)

齿片间距(mm)

材料

表面处理方式

350.0*240.0*85.0

12.0

2.8

1.0

AL-6063-T5

镀镍


 

 

 


 

 

After optimization, the maximum temperature of the surface of the radiator is reduced by 2.5 degrees Celsius, and the weight of the entire radiator is greatly reduced, which well meets the design needs of the product.

 


Copyright © 2020 三烨科技有限公司 版权所有 粤ICP备17041040号 技术支持:万广互联
首页

首页

产品

产品

电话

电话

关于

关于